Lenovo Intel Xeon Gold 5117 processor 2 GHz 19.25 MB L3

ThinkSystem servers incorporate Intel Xeon Scalable Family processors to enable critical business workloads and applications. The Intel scalable design provides significant improvement in performance, advanced reliability, scalability and hardware-enhanced security. Enhancements include higher per-core performance, greater memory bandwidth, expanded I/O, and improved security. This page allows you compare the features of the processors.

Specifications

Processor
Processor base frequency	2 GHz
Processor manufacturer	Intel
Cooler included	No
Processor codename	Skylake
Thermal Design Power (TDP)	105 W
Processor cache	19.25 MB
Processor model	5117
Processor threads	28
Processor operating modes	64-bit
Processor boost frequency	2.8 GHz
Stepping	H0
Bus type	UPI
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel® Xeon® Gold
Processor cores	14
Processor socket	LGA 3647 (Socket P)
Processor series	Intel Xeon Gold 5000 Series
Processor cache type	L3
Memory
Maximum internal memory supported by processor	768 GB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2400 MHz
Memory channels	Hexa-channel
ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card	No

Power
Thermal Design Power (TDP)	105 W
Technical details
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX, AVX 2.0, AVX-512, SSE4.2
Intel VT-x with Extended Page Tables (EPT)	Yes
Embedded options available	No
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Thermal Design Power (TDP)	105 W
Processor series	Intel Xeon Gold 5000 Series
Market segment	Server
Intel Virtualization Technology (VT-x)	Yes
Processor cache type	L3
Number of UPI links	2
AVX-512 Fused Multiply-Add (FMA) units	1
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	105 W
PCI Express slots version	3.0
Supported instruction sets	AVX, AVX 2.0, AVX-512, SSE4.2
Embedded options available	No
Market segment	Server
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Intel Turbo Boost Max Technology 3.0	No
Intel® Optane™ Memory Ready	No
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Virtualization Technology (VT-x)	Yes
AVX-512 Fused Multiply-Add (FMA) units	1
Intel® vPro™ Platform Eligibility	Yes

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SKU	4XG7A09394B	YD3400C5FHBOX	YD3200C5M4MFH	CM8071504651013	SRF8TB	01KR029B
Manufacturer	LENOVO	AMD	AMD	INTEL	INTEL	LENOVO
Processor lithography	up to 22nm	up to 22nm	up to 22nm	N/A	up to 22nm	up to 22nm
Processor family	Intel Xeon Gold	AMD Ryzen 5	AMD Ryzen 3	Intel Core i3	Intel Xeon Gold	Intel Xeon Gold
Processor socket	LGA 3647 (Socket P)	Socket AM4	Socket AM4	LGA 1700	LGA 3647 (Socket P)	LGA 3647 (Socket P)
Processor cores	14	4	4	4	16	8
On-board graphics card	N	Y	Y	N	N	N
Discrete graphics card	N	N	N	N	N	N
Cooler included	N	Y	N	N/A	N	N
Package type	N/A	Box	Tray	Tray	N/A	N/A