Cisco Intel Xeon Gold 6240 processor 2.6 GHz 25 MB L3

The Xeon® Processor from Cisco is designed to deliver enhanced reliability and flexibility for server platforms. This processor offers excellent performance and headroom for peak Internet server loads, resulting in faster response times, support for more users and improved scalability.

Specifications

Processor
Processor generation	2nd Generation Intel® Xeon® Scalable
Processor base frequency	2.6 GHz
Processor manufacturer	Intel
Processor codename	Cascade Lake
Thermal Design Power (TDP)	150 W
Processor cache	25 MB
Processor model	6240
Processor threads	36
Processor operating modes	64-bit
Processor boost frequency	3.9 GHz
Stepping	B1
Bus type	UPI
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel® Xeon® Gold
Processor cores	18
Processor socket	LGA 3647 (Socket P)
Processor series	Intel Xeon Gold 6000 Series
Processor cache type	L3
Memory
Maximum internal memory supported by processor	1 TB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2933 MHz
Memory channels	Hexa-channel
ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	150 W

Technical details
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX-512
Scalability	4S
Intel VT-x with Extended Page Tables (EPT)	Yes
Embedded options available	No
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Thermal Design Power (TDP)	150 W
Processor series	Intel Xeon Gold 6000 Series
Market segment	Server
Intel Virtualization Technology (VT-x)	Yes
Processor cache type	L3
AVX-512 Fused Multiply-Add (FMA) units	2
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	150 W
Execute Disable Bit	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX-512
Scalability	4S
Embedded options available	No
Market segment	Server
Intel® Optane™ Memory module included	Yes
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Intel Turbo Boost Max Technology 3.0	No
Intel® Speed Shift Technology	Yes
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Enhanced Intel SpeedStep Technology	Yes
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Virtualization Technology (VT-x)	Yes
AVX-512 Fused Multiply-Add (FMA) units	2
Intel® vPro™ Platform Eligibility	Yes
Operational conditions
Tcase	85 °C

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SKU	UCS-CPU-I6240B	755410-B21-RFB	4XG7A37935	YD3200C5FHBOX	YD3200C5M4MFH	BX8071512100F
Manufacturer	Cisco	HPE	LENOVO	AMD	AMD	INTEL
Processor lithography	up to 22nm	up to 22nm	up to 22nm	up to 22nm	up to 22nm	N/A
Processor family	Intel Xeon Gold	Intel Xeon E5 v3	Intel Xeon Silver	AMD Ryzen 3	AMD Ryzen 3	Intel Core i3
Processor socket	LGA 3647 (Socket P)	LGA 2011-v3	LGA 3647 (Socket P)	Socket AM4	Socket AM4	LGA 1700
Processor cores	18	10	8	4	4	4
On-board graphics card	N	N	N	Y	Y	N
Discrete graphics card	N	N	N	N	N	N
Cooler included	N/A	N	N/A	Y	N	Y
Package type	N/A	N/A	N/A	Box	Tray	Box