Lenovo Intel Xeon Gold 5217 processor 3 GHz 11 MB L3

ThinkSystem servers incorporate Intel Xeon Scalable Family processors to enable critical business workloads and applications. The Intel scalable design provides significant improvement in performance, advanced reliability, scalability and hardware-enhanced security. Enhancements include higher per-core performance, greater memory bandwidth, expanded I/O, and improved security. This page allows you compare the features of the processors.

Specifications

Processor
Processor generation	2nd Generation Intel® Xeon® Scalable
Processor base frequency	3 GHz
Processor manufacturer	Intel
Cooler included	No
Processor codename	Cascade Lake
Thermal Design Power (TDP)	115 W
Processor cache	11 MB
Processor model	5217
Processor threads	16
Processor operating modes	64-bit
Processor boost frequency	3.7 GHz
Stepping	L1
Bus type	UPI
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel® Xeon® Gold
Processor cores	8
Processor socket	LGA 3647 (Socket P)
Processor series	Intel Xeon Gold 5000 Series
Processor cache type	L3
Memory
Maximum internal memory supported by processor	1 TB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2667 MHz
Memory channels	Hexa-channel
ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card	No
Power
Thermal Design Power (TDP)	115 W

Technical details
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX-512
Scalability	4S
Intel VT-x with Extended Page Tables (EPT)	Yes
Embedded options available	No
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Thermal Design Power (TDP)	115 W
Processor series	Intel Xeon Gold 5000 Series
Market segment	Server
Intel Virtualization Technology (VT-x)	Yes
Processor cache type	L3
Number of UPI links	2
Mode-based Execute Control (MBE) version	Yes
Intel® Volume Management Device (VMD) version	Yes
Intel® Run Sure Technology version	Yes
AVX-512 Fused Multiply-Add (FMA) units	1
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	115 W
Execute Disable Bit	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX-512
Scalability	4S
Embedded options available	No
Market segment	Server
Intel® Optane™ Memory module included	Yes
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Intel Turbo Boost Max Technology 3.0	No
Intel® Speed Shift Technology	Yes
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Enhanced Intel SpeedStep Technology	Yes
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Virtualization Technology (VT-x)	Yes
AVX-512 Fused Multiply-Add (FMA) units	1
Intel® vPro™ Platform Eligibility	Yes
Operational conditions
Tcase	79 °C

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SKU	4XG7A14806B	100-000000080	100-000000041	100-000000079	100-000000081	100-100000252BOX
Manufacturer	LENOVO	AMD	AMD	AMD	AMD	AMD
Processor lithography	up to 22nm	up to 22nm	up to 22nm	up to 22nm	up to 22nm	up to 22nm
Processor family	Intel Xeon Gold	AMD EPYC	AMD EPYC	AMD EPYC	AMD EPYC	AMD Ryzen 5
Processor socket	LGA 3647 (Socket P)	Socket SP3	Socket SP3	Socket SP3	Socket SP3	Socket AM4
Processor cores	8	8	8	12	8	6
On-board graphics card	N	N	N	N	N	Y
Discrete graphics card	N	N	N	N	N	N
Cooler included	N	N	N	N	N	Y
Package type	N/A	Tray	Tray	Tray	Tray	Box