HP Intel Xeon Gold 6230 processor 2.1 GHz 27.5 MB Box

HP Intel Xeon Gold 6230. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX-512, Scalability: 4S. Compatibility: ML350 G10

Specifications

Processor
Processor generation	2nd Generation Intel® Xeon® Scalable
Processor base frequency	2.1 GHz
Processor manufacturer	Intel
Processor codename	Cascade Lake
Thermal Design Power (TDP)	125 W
Processor cache	27.5 MB
Processor model	6230
Processor threads	40
Processor operating modes	64-bit
Processor boost frequency	3.9 GHz
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel® Xeon® Gold
Processor cores	20
Processor socket	LGA 3647 (Socket P)
Processor series	Intel Xeon Gold 6000 Series
Package type	Box
Memory
Maximum internal memory supported by processor	1 TB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2933 MHz
Memory channels	Hexa-channel
ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	125 W
Technical details
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX-512
Scalability	4S
Intel VT-x with Extended Page Tables (EPT)	Yes
Embedded options available	Yes
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Thermal Design Power (TDP)	125 W
Processor series	Intel Xeon Gold 6000 Series
Market segment	Server
Intel Virtualization Technology (VT-x)	Yes
AVX-512 Fused Multiply-Add (FMA) units	2

Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	125 W
Execute Disable Bit	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX-512
Scalability	4S
Embedded options available	Yes
Market segment	Server
PCI Express CEM revision	3.0
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Intel Turbo Boost Max Technology 3.0	No
Intel® Speed Shift Technology	Yes
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Enhanced Intel SpeedStep Technology	Yes
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Virtualization Technology (VT-x)	Yes
AVX-512 Fused Multiply-Add (FMA) units	2
Intel® vPro™ Platform Eligibility	Yes
Operational conditions
Tcase	87 °C
Packaging data
Package type	Box
Other features
Compatibility	ML350 G10

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SKU	P10947-L21B	4XG7A07209	P02491-B21	P10938-B21	P18506-L21B	P08679-L21B
Manufacturer	HP	LENOVO	HPE	HPE	HP	HP
Processor lithography	up to 22nm	up to 22nm	up to 22nm	up to 22nm	up to 22nm	up to 22nm
Processor family	Intel Xeon Gold	Intel Xeon Platinum	Intel Xeon Silver	Intel Xeon Silver	Intel Xeon Gold	Intel Xeon Gold
Processor socket	LGA 3647 (Socket P)	LGA 3647 (Socket P)	LGA 3647 (Socket P)	LGA 3647 (Socket P)	LGA 3647 (Socket P)	LGA 3647 (Socket P)
Processor cores	20	16	8	8	20	4
On-board graphics card	N	N	N	N	N	N
Discrete graphics card	N	N	N	N	N	N
Cooler included	N/A	Y	N	N	N	N
Package type	Box	N/A	N/A	N/A	N/A	N/A